Multi-layer stackup analysis and automated assembly rules engineered directly into your manufacturing workflow.
Gerber DFM Validation
DFA Clearance Audits
Turnkey Board Assembly
Exhaustive review of trace tolerances, annular ring ratios, and copper weight distribution to eliminate revision spins before fabrication.
Component footprint verification, thermal relief checks, and automated SMT placement clearance mapping for high-density surface mounts.
Rapid prototyping and scalable IPC Class 3 volume manufacturing executed under automated optical inspection and rigorous thermal profiling.
We catch thermal bottlenecks and layout clearance errors before silicon touches the fabrication line.
Disciplined engineering review guarantees predictable production performance for mission-critical aerospace and medical hardware.
Quantifiable engineering performance
99.8%
First-pass production yield
48 hrs
Full Gerber stackup audit
0.05 mm
Trace clearance tolerance
Upload your Gerber RS-274X files and BOM for a complete engineering review within 48 hours.


